Production capability
PRODUCTION PROCESS
Our production zones are well – fitted, air conditioned space ensure the best quality of PCB production.
Sophisticated monitoring system is guaranteed the best efficiency and functionality at every manufacturing steps, to provide the best quality of PCB and PCBA products based on your request.
- BASE MATERIALS
- However the FR4 base material is the most common request here are some alternatives from our base material stock
- FR4
- FR4 High TG
- Halogen Free
- CEM1, CEM3
- Rogers
- Teflon
- Arlon
- Metal core substrates, Aluminum
- SURFACE FINISH
- HASL
- HAL Lead Free
- Panel Gold Plating/ Selective Gold
- Immersion Tin
- Immersion Gold
- Immersion Silver
- O.S.P.
- BIO
- Gold Connectors
- Carbon Printing
- Peelable Mask
- Kapton Tape
- VIAS
- Blind VIAs
- Burried VIAs
- VIA filling with silver paste
- BGA Tehnology
- Laser Drills
| TECHNICAL CAPABILITY CHART | CLASSIFICATION |
| ITEM | DESCRIPTION (all relative measure are expressed in µm) | STANDARD | ADVANCED | ENGINEERING R&D |
||||||
| 5 | 6 | 7 | 8 | 9 | 10 | 10 | ||||
| Track & Gap | min Track to Track (TT) / Track to pad (TP) / Pad to Pad (PP) / Thermal Line Width (TW) | 150 | 125 | 100 | 87 | 87 | 75 | 75 | 60 | 50 |
| min Track Width (MTW) / min Thermal Gap (GAP) | 87 | 75 | 87 | 75 | 60 | 50 | ||||
| Ring Rigid pcb | min Outer Layer Annular Ring (OAR) on Production Hole Diameter (PHD) | 150 | 125 | 100 | 100 | 100 | 100 | 100 | 87 | 75 |
| min Inner Layer Annular Ring (IAR) / Thermal Annular Ring on PHD | 175 | 150 | 150 | 125 | 125 | 100 | 87 | 75 | ||
| Hole Diameter | min Production Hole Diameter (PHD) for thickness 1.6 mm (Others: see table) | 400 | 350 | 300 | 250 | 250 | 200 | 150 | 125 | 100 |
| max aspect ratio PTH: see also table (Thickness / PHD) | 4 | 5 | 6 | 8 | 10 | 11 | 12 | 14 | 16 | |
| µvia – Burried via | min blind µvia drill diameter – material with glass | 150 | 125 | 100 | 75 | 50 | 50 | |||
| max blind µvia aspect ratio – material with glass (Thickness / PHD) | 0.5 | 0.6 | 0.7 | 0.8 | 1.0 | 1.0 | ||||
| min blind µvia drill diameter – material without glass | 125 | 100 | 87 | 75 | 67 | 50 | ||||
| max blind µvia aspect ratio – material without glass (Thickness / PHD) | 0.55 | 0.65 | 0.75 | 0.85 | 1.0 | 1.0 | ||||
| µvia top pad annular ring | 100 | 75 | 60 | 50 | 50 | 50 | ||||
| µvia landing pad annular ring | 100 | 75 | 60 | 50 | 50 | 50 | ||||
| µvia holewall distance to cu | 200 | 175 | 150 | 150 | 140 | 130 | ||||
| max number of laser runs/side | 1 | 1 | 1 | 2 | 3 | 4 | 4 | |||
| max number of burried vias | 1 | 1 | 2 | 4 | 6 | 8 | 10 | |||
| Drill / Cu Distance | PTH to cu on inner layers (means IAR + Value) | +75 | +75 | +75 | +75 | +75 | +75 | +68 | +60 | +50 |
| NPTH to cu on inner layers / NPTH Routing always > 250 µm (means IAR + Value) | +50 | +50 | +50 | +50 | +50 | +50 | +50 | +50 | +50 | |
| NPTH to cu on outer layers (NPTH Routing always > 200 µm) | 250 | 200 | 200 | 200 | 200 | 150 | 125 | 100 | 75 | |
| Cu Thickness | maximum total cu thickness that can be etched (no minimum) | 70 | 50 | 40 | 25 | 20 | 20 | 15 | 15 | 12 |
| Solder Mask | solder mask annular ring (MAR) & conductor overlap (MOC): typical | 80 | 75 | 75 | 75 | 60 | 60 | 50 | 40 | 30 |
| solder mask annular ring (MAR) & conductor overlap (MOC): exceptional | 60 | 60 | 50 | 40 | 30 | 25 | 25 | |||
| solder mask min segment (MSM) (If Ciselaier creates SM, MSM > = 100) | 125 | 110 | 100 | 100 | 90 | 90 | 80 | 70 | 60 | |
| Build up | max pcb thickness (mm) | >3.2 | >3.2 | 5.00 | 5.20 | |||||
| min pcb thickness tollerance (%) | 10 | 10 | 10 | 10 | 10 | 8 | 7.5 | 5 | 5 | |
| max nr. Layers (for the Flex layer add funit in complexity) | 12 | 16 | 18 | 20 | 22 | 24 | 26 | 32 | 40 | |
Ring ML Flex & Flex-Rigid Flex layers (for rest = 0 ) should be 50 µm bigger then on rigid layers
